【Magazine Release】An article written by Professor Takeo SHIBA, Visiting Researcher Koji YOKOSAWA, Professor Takao NISHIKAWA, Professor Shizuo TOKITO was released on Journal of The Japan Institute of Electronics Packaging (JIEP) Vol.22 No.7 Nov. 2019 (591-636) as a special issue "advanced packaging technology for IoT/5G era".

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【Magazine Release】An article written by Professor Takeo SHIBA, Visiting Researcher Koji YOKOSAWA, Professor Takao NISHIKAWA, Professor Shizuo TOKITO was released on Journal of The Japan Institute of Electronics Packaging (JIEP) Vol.22 No.7 Nov. 2019 (591-636) as a special issue "advanced packaging technology for IoT/5G era".

posted Nov. 15, 2019

An article written by Professor Takeo SHIBA, Visiting Researcher Koji YOKOSAWA, Professor Takao NISHIKAWA, Professor Shizuo TOKITO was released on Journal of The Japan Institute of Electronics Packaging (JIEP) Vol.22 No.7, Nov. 2019 (591-636) as a special issue "advanced packaging technology for IoT/5G era".

📚 The related article >> https://j-jiep.information.jp/info/20191101/

📚 Tokito Lab HP >> https://tokitolabo.yz.yamagata-u.ac.jp/en/index.html